Beginners: "Avoid vias in your high speed signals"
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Beginners: "Avoid vias in your high speed signals"
Kam, Lee, and Kim (IEEE Transactions on Advanced Packaging, November 2004): "More vias for us! Let's make a twisted pair on a multilayer PCB to reduce crosstalk and radiated emissions"
I'd be very curious to see if anyone has tried to replicate this work on more modern material stackups and data rates to see if it scales. They only demonstrated it at 3 Gbps.
https://koasas.kaist.ac.kr/bitstream/10203/559/1/000224975400003.pdf
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